The development of high-power electronic applications and advancements in electronic components, including miniaturisation, face the hurdle of excessive heat dissipation. The lack of effective thermal management solutions significantly impacts the performance of the devices and their durability.
CVD diamond heat spreaders exhibit about five times higher thermal conductivity than copper. Its highly rigid lattice structure provides high-frequency vibrations and limits heat flow resistance due to phonon-phonon scattering.
We collaborate with industries to develop CVD diamond heat spreaders to overcome their challenges in developing high-power electronics where they compromise with the performance, size, and durability of electronics applications.
Our thermal management solutions help industries advance the electronic components of their products. Beneficiary sectors include 5G technology, semiconductor, aerospace, telecommunication, automotive, and defence.
